PEACHTREE CITY, GA –February 27, 2026 – PCB Detroit will be returning to Wayne State University in June, the Printed Circuit Engineering Association ( PCEA) announced today. The conference will ...

SAN FRANCISCO, CA - Flux, the AI-powered platform for hardware design, today announced $37M of new investment, including a $27M Series B led by 8VC, with participation from existing investors ...

WORCESTER, MA – February 26, 2026 – The Printed Circuit Engineering Association ( PCEA) today announced the debut of the PCB Management Forum at PCB East. The all-day event will be held April 28 ...

HELSINKI – Incap Corporation reported 2025 revenue of $232 million, down 6.7% year-over-year from $248.7 million, as currency headwinds and a softer market environment weighed on results.

Atlanta — Following the Supreme Court's invalidation of IEEPA-based tariffs and implementation of new Section 122 global tariffs of 10-15%, the Electronic Components Industry Association (ECIA) is ...

B43655 and B43656 aluminum electrolytic capacitor series designed for DC link stages in electric vehicle on-board chargers supporting 800V battery architectures and forced cooling operation. B43655 ...

ECIA has issued a follow up Industry Alert from its Global Industry Practices Committee (GIPC) experts to update members on last Friday’s U.S. Supreme Court tariff ruling. The U.S. Supreme Court has ...

550/560 Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 ...

AUSTIN, TX – Creative 3D Technologies (C3DT) has raised $5 million in seed funding to expand its modular “Factory-in-a-Box” manufacturing platform.

STOCKHOLM, SWEDEN – Note has secured a defense electronics order valued at SEK 135 million from a long-term Nordic customer for advanced printed circuit board assemblies.

Keysight Technologies introduced 3D Interconnect Designer, a software platform developed to support the design of complex interconnect structures in chiplet and three-dimensional integrated circuit ...